適用材料及范圍/Application：

1、適用材料：復(fù)合片材（薄膜）3D成型領(lǐng)域，比如PC片材、PC+PMMA片材、PMMA片材等；

2、適用范圍：超薄電子配件（3D手機(jī)背蓋板/面板）、電子產(chǎn)品觸摸屏、工業(yè)銘牌/面板、3D鏤空儀表盤(pán)、電子產(chǎn)品視窗、電子外殼、汽車(chē)觸摸屏等領(lǐng)域。

1. Applicable materials: Composite sheet (thin film) 3D forming field, such as PC sheet, PC+PMMA sheet, PMMA sheet, etc.
2. Scope of application: Ultra-thin electronic accessories (3D mobile phone back cover panel/panel), touch screen of electronic products, industrial nameplate/panel, 3D hollow 

dashboard, electronic products windows, electronic shell, automobile touch screen and other fields.

設(shè)備優(yōu)點(diǎn)/Advantages of equipment：

1、控制系統(tǒng)：采用PLC+雙觸摸控制系統(tǒng)；

2、主體結(jié)構(gòu)：主體受力結(jié)構(gòu)件采用球墨鑄鐵澆鑄而成剛性好；

3、平面度：上下熱板經(jīng)氮化加硬處理，表面硬度高耐磨；

4、烘烤系統(tǒng)：片材加熱系統(tǒng)采用進(jìn)口IR紅外加熱模塊，配合溫度模塊溫度自動(dòng)補(bǔ)償控制精準(zhǔn), 移進(jìn)/移出采用伺服控制動(dòng)作快速穩(wěn)定；

5、空氣壓力：壓力范圍60-150Kg/cm2，滿足各種復(fù)雜3D拉伸要求。

1. Control system: PLC + double touch control system;
2. Main structure: The main force-bearing structural parts are cast with ductile iron and have good rigidity.
3. Flatness: The upper and lower hot plates are hardened by nitriding, and the surface is high wear-resistant in India.
4. Baking system: The sheet heating system adopts imported IR infrared heating module, with precise automatic temperature compensation control of temperature module, and 

adopts servo control to move in and out quickly and stably.
5. Air pressure: The range of pressure is 60-150 Kg/cm, which meets all kinds of complex 3D stretching

技術(shù)參數(shù)/Technical parameters：

*如有參數(shù)變更，恕不另行通知。We reserve the right to change any design and specification without ontice.